Opened 17 years ago
Last modified 16 years ago
#1302 assigned defect
test bonding on master.ipp
| Reported by: | jhoblitt | Owned by: | cindy |
|---|---|---|---|
| Priority: | normal | Milestone: | |
| Component: | hardware | Version: | |
| Severity: | normal | Keywords: | |
| Cc: |
Description
Configure ethernet bonding between master.ipp and the IPP switch in the machine shop. First roll this conf out to all ipp dev machines then the production cluster at MHPCC.
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we are currently using only 50% of our possible ethernet bandwidth. the described work would allow us to use both ethernet ports on each box.