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Opened 17 years ago

Last modified 16 years ago

#1302 assigned defect

test bonding on master.ipp

Reported by: jhoblitt Owned by: cindy
Priority: normal Milestone:
Component: hardware Version:
Severity: normal Keywords:
Cc:

Description

Configure ethernet bonding between master.ipp and the IPP switch in the machine shop. First roll this conf out to all ipp dev machines then the production cluster at MHPCC.

Change History (1)

comment:1 by eugene, 16 years ago

Owner: changed from jhoblitt to cindy
Status: newassigned

we are currently using only 50% of our possible ethernet bandwidth. the described work would allow us to use both ethernet ports on each box.

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